منابع مشابه
Effect of Conditioning and Aging on the Bond Strength and Interfacial Morphology of Glass-ionomer Cement Bonded to Dentin.
PURPOSE To determine the bond stability and the change in interfacial ultrastructure of a conventional glassionomer cement bonded to dentin, with and without pretreatment using a polyalkenoic acid conditioner. MATERIALS AND METHODS The occlusal dentin surfaces of 10 teeth were ground flat. Glass-ionomer cement was bonded to the surfaces either with or without polyalkenoic acid conditioning. T...
متن کاملInterfacial strength of Resilon and gutta-percha to intraradicular dentin.
Strengthening of Resilon-filled roots via an adhesive interface should be reflected by improvement in the interfacial strength and dislocation resistance between the root fillings and intraradicular dentin. This study compared the interfacial strengths of Resilon/Epiphany and gutta-percha/AH Plus using a thin-slice push-out test design. Failure modes of root slices after push-out testing were e...
متن کاملInterfacial adaptation of adhesive materials to root canal dentin.
Extracted single-rooted maxillary teeth were endodontically treated and filled with gutta-percha/AH-26 (GP), Resilon points/RealSeal (RS), AdheSE DC/Multicore Flow (ADH, self-etch control), or Excite DSC/Multicore Flow (EXC, total-etch control). Specimens were analyzed with electron microscopy using three methods: (a) field emission scanning electron microscopy (FESEM) of the interface; (b) tra...
متن کاملEffect of dentin desensitizers on resin cement bond strengths
1 Department of Dentistry, University of Joinville Region – Joinville – SC – Brazil. 2 School of Dentistry, University of Itajai Valley – Itajai – SC – Brazil. 3 Department of Restorative Dentistry, Piracicaba Dental School, State University of Campinas – Piracicaba – SP – Brazil. 4 Department of Cariology and Operative Dentistry, Division of Oral Health Sciences, Graduate School of Medical and...
متن کاملChip-package interaction and interfacial delamination
In flip-chip package, the mismatch of thermal expansion coefficients between the silicon die and packaging substrate induces concentrated stress field around the edges and corners of silicon die during assembly, testing and services. The concentrated stresses result in delamination on many interfaces on several levels of structures, in various length scales from tens of nanometers to hundreds o...
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ژورنال
عنوان ژورنال: Journal of Dental Research
سال: 2012
ISSN: 0022-0345,1544-0591
DOI: 10.1177/0022034512443068